Zygo Introduces Semiconductor Tool For Litho And Etch Metrology

Middlefield, CT - Zygo Corporation recently announced its new in-fab semiconductor metrology system, the UniFire-7900, designed to meet back end of the line litho and etch metrology challenges of semiconductor manufacturing processes at the 32nm node and beyond.

The UniFire-7900 optical metrology tool delivers high precision three-dimensional information that can be used for surface topography, critical dimension, overlay/registration, and film thickness metrology in one small footprint. This single, multi-functional tool will allow semiconductor manufacturers to consolidate their metrology tools in their litho and etch modules, saving valuable clean room real estate and reducing overall metrology costs.

Michael Darwin, ZYGO's Vice President, Semiconductor Solutions Business Unit, made the following comment, "The UniFire-7900 builds on the success of our first two in-fab, fully automated metrology solutions, the Z3D-7000 and Z3D-7200. With the addition of the UniFire-7900 to ZYGO's in-fab semiconductor product portfolio, ZYGO is now positioned to address customer metrology needs in the front end of line, back end of line, and wafer fabrication. Customers will use the UniFire-7900 to reduce their capital investment in metrology while taking advantage of its leading edge technology. We will continue to work closely with our customers on developing world-class optical metrology systems that meet the current and future demands of the semiconductor industry."

SOURCE: Zygo Corporation