Yield Enhancement Software for CMP process

The new CLIP (Chip Level Integrated Planarizer) software package is designed to control and improve the uniformity of Chemical Mechanical Polish (CMP) processes and the quality of the follow-on lithography process. The package contains four programs: a pattern density calculator (pictured here), a CMP simulator, a CMP model characterizer, and an automatic smart dummy filler. The package is suitable for use in Inter-Lever Dielectric (ILD) polish, Shallow-Trench Isolation (STI) processes and copper dual-damascene processes.

The product is based on the developer's CMP modeling and smart dummy filling algorithm. The developer states that the package enables single-pass dummy filling, which can save engineering and CMP machine time, as well as reduce reticle costs, according to the developer. The smart dummy fill is said to deliver up to 50% uniformity improvement over conventional in-house dummy fill and 75% over a process without dummy fill.

CMP Technology Inc, 40406 Torenia Circle, Fremont, CA 94538. Tel: 510-226-8730. Fax: 510-490-3621.