X-FAB Enhances Micrometer Chip Design For Analog/Mixed-Signal And Smart-Power Applications

Erfurt, Germany - X-FAB Silicon Foundries, the world's leading foundry specializing in the production of analog/digital integrated circuits, recently announced major enhancements to its XH035 0.35 micrometer analog/mixed-signal platform, making it the foundry industry's first to offer full modularity of digital, analog, high-voltage and embedded non-volatile memory (NVM) features, for maximum cost efficiency. This combination addresses the majority of advanced analog/mixed-signal and high-voltage design needs and, at the same time, provides a cost-effective way for companies to choose only those options that match their specific requirements. It lets them create competitive, smaller-sized designs and reuse their analog IP across different design projects. In addition, X-FAB has enhanced its existing 0.35 micrometer XH035 high-voltage devices to yield lower on-resistance (Ron) at lower mask count, enabling the design of smaller driver chips to serve the growing market of power management applications.

The new process features -- available immediately -- include a large variety of active and passive devices to address analog/mixed-signal design needs. Among these are low-leakage and low-threshold core module options, additional primitive devices such as double MIM capacitors, 10k poly resistors and Schottky diodes, as well as HV depletion and HV thin gate oxide transistors. Embedded NVM options such as EEPROM and Zener Zap result in smaller, cost-effective designs. The process also comes with verified analog IP libraries -- as a starting point for companies to develop their own analog libraries that can be reused to achieve the greatest cost efficiencies.

Dr. Jens Kosch, chief technology officer at X-FAB, said, "Our customers working on advanced analog/mixed-signal tell us that smaller, cost-effective chip design is crucial for their success. X-FAB's technology precisely meets that need -- allowing them to select from a wide choice of options and modules, efficiently place more chips on a wafer at no additional cost, and reuse their analog IP. This approach makes the overall chip price extremely cost-competitive."

For more information, please visit www.xfab.com.

SOURCE: X-FAB Silicon Foundries