Wire Bonder

The 3088 Wire Bonder has the ability to wire bond the chip to the substrate under production conditions of 60 micron wire distance. In the second quarter of next year an ultra fine pitch of 50 micron is expected.

The wire bonder features a maintenance-free flying bond head for constant and consistent bonding precision. The wire bonding platform also offers customers greater flexibility in production and higher machine productivity, according to the company. The increased bond range enables customers to run a variety of applications and to produce several devices per operation cycle on one and the same machine. It is also possible to copy via host or disk recipe data onto several machines in order to accelerate production start.

ESEC Management SA, Hinterbergstrasse 32, Cham, Switzerland CH-6330. Tel: 041 749 51 11. Fax: 041 749 51 77.