Westwind To Demonstrate Advanced Spindle Technology At Semicon Japan Show

Tokyo, Japan - Westwind Air Bearings will be showcasing a range of spindle technologies for semiconductor processing applications, including back grinding, edge grinding, dicing and wafer spinning, at the SEMICON Japan 2006 Show, being held 6th to 8th December 2006, at the Makuhari Messe Exhibition Event Hall and Conference Center, Chiba, Japan.

Located in Booth #7C-703, GSI Group Japan Corporation - Westwind Air Bearings Division, supplies state-of-the-art wheelhead and workhead air bearing spindles, with speeds up to 15,000 rpm, for wafer grinding applications up to 300mm diameter. Westwind wafer dicing spindles are capable of carrying single or multiple blades with diameters from 50 to 100mm. Recent developments for 300mm wafer processing include longer bodies for greater reach, larger brushless DC motors for greater power up to 2.2kW and rotational speeds up to 60,000 rpm. A dual shaft tool design, which performs both rough- and finish-grind operations with a single spindle, is another latest development from Westwind for improved productivity.

Itsuro Ishii, General Manager Sales & Marketing, GSI Group Japan Corporation - Westwind Air Bearings Division, said: "Westwind provides new solutions by working closely with our clients on customised designs. We encourage anyone to visit Westwind's booth at Semicon Japan to discover how air bearings could benefit their application."

Benefits of using air bearings include high precision, cleanliness of operation, operation in high vacuum environments, high bearing stiffness and high rotational speeds up to 300k rpm.

SOURCE: Westwind Air Bearings