waferMAP

Wafer mapping provides an intuitive graphical interpretation of metrology, PCM and test data. Through parametric and bin wafer mapping, a complete overview of the information in your data can be graphically represented and analyzed in the physical layout of a wafer. waferMAP contains the tools to perform multiple prospect analysis simultaneously. This allows you to swiftly detect, isolate, correlate and ultimately eliminate such problems as non-uniform processing on the wafer, mask or reticle defects, or wafer probe issues at test. waferMAP offers an indispensable visual perspective of your wafer data by providing the ability to perform in-depth correlation of electrical test results to in-process inspection parameters. All binning and parametric results are graphically and intuitively represented.

The click of a button on the waferMAP screen makes available zonal analysis by column, row, quadrant, circular zones, radial zones, and stepper fields. This enables the fast isolation of key areas of sensitivity. Interactivity within all views also allows test results to be examined and correlated from a variety of perspectives.

waferMAP proves to be an extremely powerful and fast tool for the engineering professional who needs to identify fabrication processing problems, reduce manufacturing cycles, lower costs, improve quality and increase yields. waferMAP features include:

• PARAMETRIC WAFER MAPS
• BIN MAPS
• YIELD MAPS
• MATHEMATICAL AND GRAPHICAL ZONAL ANALYSIS
• MULTIPLE PARAMETRIC OR BIN MAPS
• COMPOSITE MAPS
• INTEGRATED HISTOGRAMS
• X-BAR-S CHARTS BY ZONE
• DIE YIELD MAPS
• ANOVA BY ZONE

IDS Software Systems, 3 Waters Park Drive, Suite 222, P.O. Box 6936, San Mateo, CA 94403. Tel: 650-349-0500; Fax: 650-349-0101.