Product/Service

Wafer Thinning Systems

Source: Tru-Si Technologies
The Tru-Etch 2000 and Tru-Etch 3000 all-dry etching systems for thinning silicon wafers use Atmospheric Downstream Plasma and No-Touch wafer handling technologies
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The Tru-Etch 2000 and Tru-Etch 3000 all-dry etching systems for thinning silicon wafers use Atmospheric Downstream Plasma and No-Touch wafer handling technologies, enabling a new era for Moore's Law by allowing the vertical size of advanced packages to shrink to the previously unattainable limit of 2 mils.

With the systems, a throughput of more than 100 200mm wafers per hour with 0.8% of one Sigma uniformity is possible. The systems control maximum wafer temperature during the processing within a range of 150-350°C.

Tru-Si Technologies, 657 N. Pastoria Ave., Sunnyvale, CA 94086. Contact: Sergey Savastiuok, 408-720-3333; Fax: 408-720-3334.