The FSM 228 makes use of a pair of autopositioning and highly sensitive backpressure probes to gauge wafers substrate thickness after backgrind
Frontier Semiconductor makes use of a pair of autopositioning and highly sensitive backpressure probes to gauge wafers substrate thickness after backgrind. The system is also capable of measuring very thin backgrind wafers below 200 microns.
The system measures thickness of polished, unpolished, deposited or product wafers. It will also handle wafers with adhesive tapes still in place. The system can be programmed to automatically measure multiple points on the wafer. Results are reported in a wafer map showing individual thickness. Statistics include minimum, maximum, mean and total thickness variations. Results can be exported to spread sheet programs, like Excel, for further analysis.
Specifications include:Wafer size: 2, 3, 4, 5, 6, and 8 inchesThickness range: 2 mm to 100 micronsAccuracy: +/- 1 micronsResolution: 0.1 micronPrecision: better than 1 micronsAir supply: clean dry air or nitrogenPressure: 20 to 80 psiComputer: 586 PC, 1 Gb HarddiskPower supply: 110/220V, 50/60 HzWeight: 80lbs
<%=company%>, 1631 North First Street, San Jose, CA 95112. Tel: 408-452-8898. Fax: 408-452-8688.
