Wafer Stepper
Ultratech Stepper, Inc.Spectrum 300 builds on Ultratech's 1X lithography system with its broadband lens that allows for automatic selection of exposure spectrum (i-line, gh-line or ghi-line). The tool has a low numerical aperture lens design, tailored to provide maximum depth-of-focus for bump applications, and it is available in a variety of field sizes. Its high illumination intensity results in high throughput with high dose exposures, while its Machine Vision System allows for alignment to any feature on the wafer. Together with Ultratech Stepper, Inc.Spectrum 3, the systems can accommodate all wafer sizes from 100mm to 300mm, and have the ability to process both thin (1 to 10 microns) and thick (10 to 100 microns) resists on the same stepper. They are equipped with imaging resolution down to 2.0 microns and are expected to support all flip-chip-related lithography processing requirements for the next several years.
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