Wafer Processing Engineers Consider Role Of Machine-Vision Technology In Setting Wafer-Transfer Coordinates

Beaverton, OR - Engineers from a maker of wireless metrology devices for wafer processing equipment, CyberOptics Semiconductor, Inc., will discuss the role of machine-vision technology in setting wafer-transfer coordinates during demonstrations of the company's Wafer Sense Auto Teaching System (ATS) at SEMICON Taiwan at booth 1006 with distribution partner Aceteam Corp. in the Taipei World Trade Center from September 9-11.

A team of engineers from CyberOptics Semiconductor -- a subsidiary of CyberOptics Corp. -- will address how process engineers at both 300 mm and 200 mm fabs who employ common eyeballing techniques to calibrate wafer-handoff equipment generally don't obtain the three-axis (x, y, z) coordinates needed to establish optimal transfers and uniform process controls, according to Dennis J. Bonciolini, the company's CTO.

Bonciolini said that fab engineers without the proper tools to identify targets inside process equipment are effectively unable to establish precise wafer-transfer coordinates for robots and often encounter wafer particulate contamination, extended equipment setup and maintenance time and station-to-station variance.

"When you consider that fabs in Taiwan and Southeast Asia have basically been leading the charge in equipment spending this year, there's certainly an active movement at those fabs to further automate their processes," Bonciolini said. "And what we're seeing is that when process engineers visually estimate transfer coordinates for robots -- particularly when they can't see those targets -- they run into more wafer scrap, downtime for troubleshooting and reduced yield. The practice essentially disrupts the overriding goal of automation."

Engineers from CyberOptics Semiconductor at SEMICON Taiwan will demonstrate how the WaferSense ATS, a wafer-like device, uses machine-vision technology to capture real-time shots of critical targets during processing. The ATS' on-board camera obtains live video and reports in real-time the ATS' coordinates in relation to a target and includes companion TeachView and TeachTarget software.

CyberOptics Semiconductor will also demonstrate its entire line of Wafer Sense products at SEMICON Taiwan, including its Auto Vibration System (AVS), Auto Leveling System (ALS) and Auto Gapping System (AGS). Each device follows the processing life of a wafer.

Bonciolini added that the ATS -- and entire WaferSense line -- was developed by CyberOptics Semiconductor as part of its "heavy focus" on R&D to address metrology challenges in fabs.

The ATS is available in 200 and 300 mm form factors and has an accuracy of +/-0.1 mm (X and Y positions) and +/-0.5 mm (Z position). The device was recently named a 2008 Editors' Choice for Best Product by Semiconductor International.

The WaferSense ATS package includes the teaching wafer, USB-compatible link, TeachView™ and TeachTarget software CD, charging case and suitcase.

SOURCE: CyberOptics Semiconductor, Inc.