Product/Service

Wafer Metrology Tool

The Zygo CP 200wl Critical Planarity Measurement System provides high spatial resolution, nanometer scale surface height and planarity measurements
Zygo Corporation 200wl Critical Planarity Measurement System provides high spatial resolution, nanometer scale surface height and planarity measurements. This system allows semiconductor manufacturers faster process development and precision process control during production for parametric control and optimization of the chemical mechanical polishing (CMP) process.

This tool provides non-contact, automated, and high-performance 3D surface height and planarity measurements on wafers for rapid characterization and quantification of photo-lithographic, etch, and polishing process effects. Applications include surface measurements of planarity, uniformity, step-heights of structures, and micro-roughness.

<%=company%>, Laurel Brook Road, Middlefield, CT 06455-0448. Tel: 860-347-8506. Fax: 860-347-8372.