Wafer-Level IR Mercad System
Source: Hypervision, Inc.
Mercad Telluride array technology has been integrated into a line of emission microscopes and backside wafer systems
Hypervision, Inc.d Telluride array technology has been integrated into a line of emission microscopes and backside wafer systems. The Mercad Telluride increases by up to 7x to 10x the sensitivity to photon emissions from chip leakage, especially from the backside.
For spatial resolution, a beam splitter links the Mercad Telluride array and the industry-standard BEAMS (Backside Emission Analysis Microscope System) sensors with 0.25µm spatial resolution. BEAMS is most sensitive to wavelengths from 400nm to 1200nm, while Mercad Telluride is most sensitive from 100nm to 1500nm. The combination yields a high spectral response and allows mercad arrays to be used in wafer-level work for the first time.
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