Wafer Inspection System

Robotic Vision SystemsS-2000 bumped wafer inspection system provides full surface defect detection in addition to bump defect and dimensional inspection capabilities. A new laser technology allows the system to perform a full 3D inspection at twice the previous throughput.

3-D laser technology provides accurate measurement of variables such as bump height and coplanarity. The system operates at twice the speed of previous systems, gathers thousands of 3-D data points in a fraction of a second.

2-D vision technology uses a high-speed, high-resolution TDI camera to perform full surface defect, bump defect, and bump dimensional inspection. Combining this with inspection algorithms allows the system to identify defects such as missing throughput, while inspecting bump features including diameter and true position.

The system outputs a range of data for process analysis, including per-bump data, wafer data, lot summaries and a graphic wafer map that allows easy viewing of trends across the wafer.

The machine's robot handling system provides accurate, repeatable transfer of wafers from 4in to 8in in size.

<%=company%>, 5 Shawmut Road, Canton, MA 02021, Tel: 781-821-0830, Fax: 781-828-9852