Wafer Defect and Process Analysis Package
Source: August Technology
YieldPilot is a defect and process analysis package for wafer, die and bump manufacturers
August Technologyis a defect and process analysis package for wafer, die and bump manufacturers. The package provides intuitive visualization of defect data, permitting users to remotely access, analyze, classify and store wafer, bump and probe mark defect data.
The package consists of four tools including a server; defect image capture station; the "Wafer Browser" which gives users an overview of their processes through wafermap and defect image galleries; and the "Smart Sampler" defect classification component which minimizes the time for review by using Spatial Signature Analysis, Defect Size Binning, Repeater Defect Detection and Wafer Overlay Analysis.
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