Wafer Cleaning System
Source: Semitool, Inc.
An application module which allows side-selective, multi-process treatment of semiconductor wafers, the Capsule Process System performs single- or dual-side cleaning and etching within a controlled microenvironment
An application module which allows side-selective, multi-process treatment of semiconductor wafers, the Capsule Process System performs single- or dual-side cleaning and etching within a controlled microenvironment. It is designed to allow one side of the wafer to be processed while the other side remains unprocessed. This capability is important for backside cleaning and etching as it affords the ability to select the most effective surface treatment for one side without risk of damage to the other side of the wafer. It can also process both sides of the wafer with like or different media, including rinse and dry of one or both surfaces. The side-selective capability also supports applications such as bevel and edge cleaning to remove films and particles from the exclusion zone of the wafer.
Semitool, Inc., 655 W. Reserve Dr., Kalispell, MT 59901. Tel: 406-752-2107. Fax: 409-752-5522.