W770 Chip Component Trim System

Packard BioChip Technologiesip Component Trim System is a next-generation laser chip trimming solution that features TrimPulse technology. The technology delivers the first breakthrough in thick-film laser trimming in more than two decades and offers higher throughput than ever before. The system breaks through the performance barrier in high-volume chip trimming- a barrier that, until now, has kept manufacturers from realizing their true profit potential.

While conventional laser systems offer only four dimensions of control- laser power, bite size, spot size, and Q-rate- TrimPulse adds a fifth: pulse width control. It lets users match the laser cutting parameters to paste material. As trim rates are increased, pulse width remains constant with no compromise in trim quality. With the technology, the system can trim Q-rates beyond 40 KHz with flawless precision.

Breakthrough chip processing requires a beam positioning system optimized for ultra-fast L-cuts with near zero radius turning for the highest possible accuracy without any slow down in trim speed. To meet this challenge, the company optimized ever component of the W770's galvanometer system to ensure the highest speed and accuracy in today's high volume production environments.

The proprietary micro-step servo controller delivers precise, predictable L-cuts. These flawless L-cuts are generated with high acceleration to produce the tightest turning radius with unsurpassed precision. The result is trim speeds over 200mm/second.

Based on the company's measurement technology, the forced voltage, current nulling bridge offers 0.02% accuracy/ For low Ohm applications, the W770's measurement system, coupled with TrimPulse, assures the same excellent cut quality and accuracy below 5 milliohms.

Like the W770 system itself, the automated intelligent parts handler is simple, elegant, and compact- a suitable failure-free solution for true "lights out" manufacturing. The handler sets the standard for reliability and versatility in chip processing. It handles even the smallest package sizes, easily processes multi-lot jobs, and manages broken parts with ease. Fast exchange times, row-to-row index times, and probe speeds are combined with excellent positioning accuracy to ensure the highest quality throughput on the production floor. Up to 33 cassettes are supported, each holding 800 substrates.

<%=company%>, 105 Schneider Road, Kanata, Ontario, Canada K2K 1Y3. Tel: 613-592-1460. Fax: 613-592-5706.