Vistec's Fully Automated Infrared Inspection And Review System IRIS2000 Delivered To Japan
The brandnew IRIS2000 will be used to control glued wafers in the customer's production. Inspection with infrared light enables to see "through" Silicon wafers. Therefore, infrared inspection can detect defects which are not visible by any other illumination method.
"Our reliable inspection system offers process engineers a tool to identify defects located in the glueing layer between the wafers", explains Product Manager Andreas Machura.
The IRIS2000 will be used in a production line where each sensor must be inspected. Therefore, the high throughput of up to 12,000 dies per hour was a decisive factor for the Japanese customer to choose the infrared inspection and review system. "The effective and user-friendly software was a further factor that sealed the deal for Vistec", says Vistec General Manager Gerhard Ruppik.
Using the well proven Smart Defect Inspection (SDI) method based on a dynamic reference image enables reliable wafer control, independent of normal process variations.
A wide range of measuring possibilities from CD and Overlay, defect sizes to fill and mould parameters, allows effective monitoring of the whole production process.
Combining fast imaging with high defect sensitivity, the system offers prompt and reliable analysis and highly reproducible results. Together with its intelligent user interface and robustly designed hardware these features make IRIS2000 the ideal tool for process control in sensor manufacturing where inspection through a Silicon layer is necessary.
SOURCE: Vistec Semiconductor Systems GmbH