Vistec Receives Multiple Orders For Automated Macro Defect Inspection System

Weilburg, Germany - Vistec Semiconductor Systems GmbH announced recently that it received multiple orders for its LDS3300 C macro inspection system from one of the leading semiconductor manufacturing and technology company. The systems will be used for front, back and macro inspection and review of 45 nm and 32 nm devices.

The first two purchase orders for the automated macro defect inspection system Vistec LDS3300 C have already been posted, worth more than four million US-Dollar, and several further orders for other 300 mm fabs are scheduled.

According to Gerhard Ruppik, General Manager of Vistec Semiconductor Systems, "The Vistec LDS3300 C orders reflect a growing need of 70 nm and 45 nm fabs to reevaluate their macro defect inspection strategy. What has finally convinced our customer to choose us as their first choice provider, is the unique system modularity offering automated defect inspection for the entire wafer surface including frontside, backside and edge/bevel/apex as well as the integrated review capability offering high optical performance in the UV and Deep UV mode. Beside the various technical advantages, the manufacturer's responsible engineers highly appreciate the superb application and service support offered by Vistec Semiconductor Systems.

SOURCE: Vistec Semiconductor Systems GmbH