Vistec Launches New Wafer Edge And Backside Inspection Solution
The system's parallel processing capability allows simultaneous wafer inspection of the front / backside and the edge/bevel – at throughputs of up to 130 wafers per hour. A single rotation of the wafer is sufficient for wafer edge inspection to deliver the detection results and defect images. The image-based technology convinces with 1µm sensitivity and allows for optional high resolution microscopic review of defects.
Process problems (for litho, CMP, etch and other applications) are automatically detected, and can be analyzed with the review function. The outstanding detection methods and algorithms enable differentiation between acceptable process variations and real defects.
The results are delivered in color, as full wafer images and high-resolution single defect images. "The color detection and color defect images are what make the LDS3300 unique," explains Thomas Groos, Senior Product Manager.
In addition, the system has a specially developed illumination system with variable illumination angles for optimal adaption to different applications, such as defocus detection or CMP scratches. The modular configuration of the combined ‘micro-macro' system enables adaptation to current and emerging process requirements.
Last year, Vistec Semiconductor Systems conducted extensive beta-site evaluations with customers in Asia, USA and Europe.
The various integrated detection principles achieve the best results for a range of applications. "This means we are already able to meet future ITRS roadmap specifications today," underlines Thomas Groos.
SOURCE: Vistec Semiconductor Systems