Product/Service

Vacuum Assisted Underfill Dispenser

Source: Speedline Technologies CAMALOT
The Vortexx vacuum injection system for void-free µBGA underfill applications uses a two-head injection option and can process µBGA strips at twice the normal unit-per-hour throughput
Speedline Technologies CAMALOT vacuum injection system for void-free µBGA underfill applications uses a two-head injection option and can process µBGA strips at twice the normal unit-per-hour throughput.

In the Type IV µBGA underfill process a vacuum is applied to one side of the µBGA strip, while material is injected between the top and bottom layers of tape securing the µBGAs. The injected material moves under the ball grid array to create a complete, void-free bond between the chip and substrate.

Because the unit can inject higher viscosity underfill materials, it can be used on larger die applications to help avoid CTE concerns associated with traditional µBGA packaging applications.

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