UTAC Running Volume Device Test Production On Teradyne UltraFLEX
The UltraFLEX system incorporates all the features of the FLEX Platform architecture. UltraFLEX high-density instrumentation provides the digital speed, pin count, and precision measurement for multi-site testing of next-generation devices. The system's low-jitter design reduces guard-band requirements. Better noise performance means fewer samples are needed during testing, resulting in higher throughput.
"The Teradyne FLEX Platform provides a cost competitive testing edge for the broadband communication market that UTAC is serving," said CK Tan, Group Vice President of Corporate Test Development, UTAC. "With our base of FLEX Platform systems, we now have the unique capability to support customers in every phase of the semiconductor SOC life cycle, from engineering development to volume production for datacom, broadband, graphics, and computing devices."
"The FLEX Platform clearly has made an impact within the semiconductor industry and, in particular, with test and assembly subcontractors who value the platform's quick implementation into production," said George Rose, General Manager, Teradyne Semiconductor Test Broadband Business Unit. "UTAC is one of the leading test and assembly subcontractors, responsible for testing some of the industry's most advanced SOC devices. Their UltraFLEX systems provide the performance and economics to meet production test requirements for high performance technologies that demand precision test solutions and low cost-of-test."
SOURCE: Teradyne, Inc.