Underfill and Encapsulation, In-line Dispensing System
Source: Asymtek
The Millennium M-2020 semiconductor dispensing system delivers high-speed and highly accurate dispensing for demanding microelectronics applications for semiconductor package and board assembly
Asymtekillennium M-2020 semiconductor dispensing system delivers high-speed and highly accurate dispensing for demanding microelectronics applications for semiconductor package and board assembly. The system dispenses a range of encapsulants, adhesives, and thermal compounds while delivering 2g peak acceleration and repeatability of +0.025mm in high-throughput environments.
The platform's DP-3000 servo-controlled linear pump delivers the accuracy and closed-loop repeatability required for intricate operations such as underfill of flip chips, chip scale packages, and chip-on-board assemblies.
The system's pump is a true positive displacement linear pump that is not affected by fluid viscosity, supply pressure, needle size, or fluid/pump temperature.
Dam and fill operations are accomplished with an optional dual-action dispensing head. The system incorporates the Millennium Mass Flow control System to deliver a calibrated fluid supply with software-managed temperature control.
<%=company%>, 2762 Loker Avenue West, Carlsbad, CA 92008. Tel: 760-431-1919; Fax: 760-431-2678
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