Ultratech Stepper names industry veteran Dan Meisburger vice president of engineering
"With Dan's extensive experience in the industry, we plan to leverage his knowledge in developing and expeditiously bringing to market advanced lithography products that will expand our leadership position in existing and new niche lithography arenas," stated Denzel. "His vast knowledge in diverse technologies and systems-integration issues, as well as his familiarity with our customers, gives us extreme confidence in Dan's leadership role in developing technology to meet our customer's next-generation lithography requirements."
Prior to joining Ultratech, Meisburger served three years as principal of W D Meisburger Consulting Services. Before that, he was vice president and general manager of KLA Tencor's SEMSpec Division, leading the product development, operations, applications engineering and marketing efforts. As vice president of technology for the SEMSpec division, Meisburger was responsible for developing the world's first high-speed electron beam wafer inspection machine and implementing the technology into commercial applications. He also served as vice president of technology for KLA-Tencor's technology division and director of engineering for KLA-Tencor's advanced inspection department. In addition, Meisburger was an advisory engineer in the e-beam testing and engineering department for IBM's GTD division.
Meisburger is currently a Consulting Professor in the department of electrical engineering at Stanford University, and was a GCA Corporation Research Fellow in the physics department at Imperial College in London. He earned a Ph.D. in electron optics and solid-state physics and a master's degree in physics from the University of Rochester, Rochester, N.Y., and a bachelor's degree in physics from Montana State University. Meisburger has 15 published papers and has been awarded seven patents.
Certain of the statements contained herein may be considered forward-looking statements that involve risks and uncertainties, such as future technological advances, the cyclicality in the thin-film head and semiconductor industries, delays, deferrals and cancellations of orders by customers, pricing pressures, competition, lengthy sales cycles for the company's systems, ability to volume produce systems and meet customer requirements, the mix of products sold, dependence on new product introductions and commercial success of any new products, integration and development of the Verdant operation, manufacturing inefficiencies and absorption levels, risks associated with introducing new technologies, inventory obsolescence, international economic and political conditions, delays in collecting accounts receivable, extended payment terms, changes in technologies and the effects of the California power shortage. Such risks and uncertainties are described in the company's SEC reports including the company's Annual Report on Form 10-K filed as of December 31, 2000 and form 10-Q filed as of March 31, 2001.
About Ultratech
Founded in 1979, Ultratech Stepper, Inc. designs, manufactures and markets photolithography equipment used worldwide in the fabrication of integrated circuits, microsystems devices, and thin film heads for disk drives. The company produces products that are designed to substantially reduce the cost of ownership for manufacturers in the electronics industry. The company's home page on the World Wide Web is located at http://www.ultratech.com .
Source: Ultratech Stepper, Inc.