Ultragages

ADE Corporationtion has introduced the 9530-NT UltraGage and 9505-NT UltraGage which measure 8,700 data points in less than 60 seconds. This large number of data points provides the precision required for measuring thickness and shape, and for calculating stress.

The 9505-NT UltraGage characterizes thin film stress and wafer shape for both patterned and monitor wafers. It provides fast, high-resolution measurements in two dimensions, and correlates with x-ray diffraction, which is the only direct measure of thin film stress. It is not sensitive to film type, reflectivity or other optical reflections that may result from subsurface multi-layer stacks. An off-line software package enables the 9505-NT to measure both local and global stress.

The 9530-NT applies ADE-industry standard metrology to backgrind, etch and lap processes that reduce wafer thickness to as little as 150 µm. It is designed for production operations that demand high performance metrology for equipment set-up, process qualification and on going process control of next generation wafer thinning processes. The 9530-NT measures wafers as thin as 150 µm while maintaining the industry-leading data density. It keeps wafers safely centered within its dynamic measurement range.

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