Tungsten Product Solutions

Novellus Systems Inc.ellus' tungsten solutions combine the productive multistation sequential deposition architecture with process innovations such as high-pressure nucleation, resistive heating, vacuum wafer clamping, and full-coverage deposition, using patented wafer backside exclusion technology to provide best-of-breed tungsten product solutions.

Features:
Concept Two ALTUS
Integrating the Concept One tungsten process chamber on the modular Concept Two platform, ALTUS offers dual loadlock and advanced wafer handling to increase system throughput and reduce cost of ownership, as well as tungsten manufacturability guarantees and uniform deposition to 194mm.

Concept Two Dual ALTUS (shown above)
Concept Two Dual ALTUS integrates two Concept One process chambers for a total of 10 stations. Dual ALTUS delivers the industry's highest throughput and lowest cost of ownership for tungsten applications at sub-0.35 micron.

PRISM
The PRISM system is expressly designed to meet the challenges of MOCVD TiN processing with film quality at high productivity. PRISM TiN barriers meet all the requirements of advanced applications, including high conformality and film stability, as deposited.

Concept Three ALTUS
The ALTUS multistation sequential deposition, coupled with the excellent temperature control from the pedestal design, continues to provide good performance for 300mm tungsten. Full coverage has been enhanced by an exclusion ring reference design. VAT has been substantially improved through faster wafer indexing, reduced chamber volume, and optimized purge time.

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