Triple Cell Wafer Plating Tool

Features:

• Includes (3), Single Wafer Plating Cells
• Use up to (3) Different Chemistries
• Wafers Rotate During Plating Cycle
• Anodes Traverse Across Wafers During Cycle
• Uniformity Within 4-6%
• Consistent Deposition Rates
• Manual Microprocessor or PC Based Controls

Patented plating tool features three plating cells. each designed to plate a single wafer at a time. Wafers mount to rotational fixtures, which rotate during the plating cycle. Lateral-moving anodes move back and forth across the face of the wafers, allowing the wafers to see the anodes from different angles.

Stewart Technologies, Inc., 730 West 22nd Street, Tempe, AZ 85282. Tel: 480-966-8333; Fax: 480-966-8444.