Toshiba Announces New Multi-Chip Module For DC-DC Converters

Irvine, CA -- To address the demand for higher current and higher frequency power solutions for DC-DC converters, Toshiba America Electronic Components, Inc. (TAEC)* with its parent company, Toshiba Corporation (Toshiba), announced that the company has created a multi-chip module (MCM) that combines a driver IC with a MOSFET and Toshiba MOSBD, a single-die combination of a power MOSFET and a Schottky Barrier Diode, in one compact package to achieve greater power output, higher efficiency, and a faster response.

Developed by Toshiba, the first of these MCM's in a planned series for DC-DC converter applications is designated TB7001FL. The device features a wide input voltage range, a high operating frequency up to 1MHz, and a small, thin package (8mm x 8mm x 0.85mm), to make it a solution for use in applications such as notebook and desktop PCs, servers, and high-current point of load DC-DC converters.

The device includes a high side MOSFET, a MOSBD to handle low-side functions in the DC-DC converter, and a driver IC that includes a high speed MOS gate driver and level shifter functions to drive the high-side MOSFET. Built-in functions include low-side MOSBD shutdown input, thermal shutdown, and under-voltage protection. The MCM solution minimizes stray inductance because the bonding wires are very short. This enables the device to achieve a higher efficiency than would be achieved with comparable discrete solutions. The compact, innovative packaging radiates heat from the bottom of the MCM, dissipating it into the printed circuit board. This enables the device to achieve very low thermal resistance of approximately 3 degrees Celsius per watt, and high efficiency ratings of 84 percent (at V(in) = 12V, V(out) = 1.5V, I(out) = 20A and F(c) = 1MHz).

By adding the driver IC with supplementary capabilities including protection features such as the MOSBD shutdown input, thermal shutdown and under-voltage protection, the new TB7001FL MCM provides a level of integration beyond the dual-channel MOSBD, which combined a high-side MOSFET with a low-side MOSFET/Schottky Barrier Diode.

"With this device Toshiba is responding to customer demand for higher power, faster response time, increased precision, and higher efficiency all in a smaller structure for their portable devices," said Sam Abdeh, business development specialist for power products for TAEC. "This new MCM showcases Toshiba's expertise in innovative packaging for components targeted for use in ever-smaller consumer electronic devices by integrating three key devices into a single module to give design engineers the ability to produce more powerful, yet smaller mobile products."

SOURCE: Toshiba America Electronic Components, Inc.