Thin Film Wafer Mapping System

MKS Spectra Products has introduced the optical Thin Film Wafer Mapping System. This system measures the thickness of metal films on transparent sample wafers from 18mm to 150mm diameter. The measurements taken are accurate to within +/- 1 Angstroms and repeatable to within +/- 1 Angstroms. The system will map a wafer at pre-programmed intervals of 2, 5 and 10 mm increments as well as user programmed locations.

Spectra's Thin Film Wafer Mapping System performs several functions: First, it allows automated thickness measurements. This measurement system is a stand alone instrument that provides the user with an important measurement, metal film thickness. Second, it offers something that no other product can do, mapping metal thickness measurement. Users of MKS Spectra's Thin Film Wafer Mapping System benefit from the automated process of measurement and calculation so that numerous wafer measurements can be made quickly, to determine deposition thickness or metal thickness uniformity. Overall, users can now make large numbers of measurements to confirm quality and uniformity of metal coated substrates.

N/A, 380 Woodview Ave, Morgan Hill, CA 95037. Tel: 408-778-6060 or 800-VAC-CHECK ; Fax: 408-776-8575.