Product/Service

Thermally-Conductive Adhesives

Source: Dow Corning Corporation
The company offers literature describing primerless silicone adhesives for the electronics industry.
The company offers literature describing primerless silicone adhesives for the electronics industry. The 8-page brochure highlights the company's line of thermally conductive adhesives, with potential applications such as bonding hybrid IC components to substrates and securing heat sinks.

The featured materials are well suited for bonding in environments where thermal stress and heat buildup are primary concerns. All of the formulations are non-corrosive, heat-cured materials which develop no cure by-products, allowing their use in complete confinement.

Covered in the literature are the company's Thermally Conductive Adhesives, a family of one- and two-part silicones that cure with heat to produce durable, low-stress elastomers. The materials are specially formulated to provide good primerless adhesion to a variety of substrates, including ceramics, epoxy laminate boards, reactive metals, and filled plastics.

The brochure provides adhesive descriptions, key features, potential uses , and application methods, formatted in an easy-to-read table. Included are flowable materials that can be used for electronic devices requiring improved heat dissipation, as well as thermally conductive formulations with potential applications that include potting/encapsulating power supplies, transformers, coils, relays, and modules.

Also provided in the literature is a 2-page chart detailing the specific physical properties of the silicone adhesives. The chart includes data on tensile strength, elongation, tear strength, viscosity/flowability, durometer hardness, electrical properties, cure time/temperature, and other properties.

The adhesives generally offer long working times and produce no corrosive or harmful byproducts during cure, which progresses evenly throughout the materials upon application of heat. All of these platinum-catalyzed adhesives should be cured at or above 100°C (212°F). Thin sections of less than 2 mils may be cured within 15 minutes at 150°C (302°F).

These silicone formulations are designed to provide unprimed adhesion to many reactive metals, ceramics and glass, as well as selected laminates, resins, and plastics. However, good adhesion cannot be expected on non-reactive metal substrates or non-reactive plastic surfaces, such as Teflon, polyethylene, or polypropylene.

To assist users in promoting adhesion to a wider range of substrates, a primer selection guide is also provided in the brochure. The chart includes VOC content, flash point, special properties for each primer, and recommendations for various material substrates.

Adhesives are available in nominal 1-, 8-, 40-, and 440-lb containers, net weight. Shelf life of any specific formulation is indicated via the "Use By" date found on the product label.

Dow Corning Corporation, P.O. Box 0994, Midland, MI 48686-0994. Tel: 517-496-6000 or 800-346-9883. Fax: 517-496-8026.