Product/Service

Thermal Diffusion Module

Source: Implant Sciences Corporation
The Thermal Diffusion Module allows the user to model the affect of a thermal anneal cycle on a given distribution profile.
The Thermal Diffusion Module allows the user to model the affect of a thermal anneal cycle on a given distribution profile. Anneal cycle ramp up, ramp down, and constant temperature segments are dictated by the user. Multiple anneal cycles can be stored in memory for reuse. Optimal implant parameters and anneal times and temperatures can be quickly and easily determined.

  • Multiple anneal cycle
  • Programmable anneal cycle Store up to 100 separate cycles
  • Anneal multi-layer profiles
  • Original unannealled profile remains intact for comparison/optimization
  • Handles thermal diffusion for a wide variety of materials including Si, GaAs, InP
  • Library of diffusion constants user modifiable an expandable

    Implant Sciences Corporation, 107 Audubon Road, Suite 5, Wakefield, MA 01880. Tel: 781-246-0700; Fax: 781-246-1167.