ThermaCEP
Source: INCEP Technologies, Inc.
The trend in electronic packaging for systems and subsystems has been to continuously reduce size while increasing performance, both of which contribute to heat generation and heat density.
The trend in electronic packaging for systems and subsystems has been to continuously reduce size while increasing performance, both of which contribute to heat generation and heat density. Higher heat densities have mandated that thermal management be given one of the highest priorities in the design cycle. In order to avoid soft failures, short-term or long-term hard failures, the key is to control heat generation and heat dissipation such that reliability is maintained.
INCEP is developing patented approaches which not only consider the substantial increases in chip and module heat flux, but also how this must be addressed as part a system where increasing power distribution and EMI containment requirements are critical design problems.
INCEP Technologies, Inc., 10650 Treena Street, Suite 308, San Diego, CA 92131. Tel: 858--547-9925; Fax: 858-547-9926.