The Tantalum Target
Source: Tosoh SMD, Inc.
The Tantalum Target features a reduced grain size for advanced semiconductor PVD (Physical Vapor Deposition) barrier processes...
The Tantalum Target features a reduced grain size for advanced semiconductor PVD (Physical Vapor Deposition) barrier processes. This reduced grain size Tantalum Target features a low oxygen content and a high strength diffusion bond.
These modules have a reduced grain size of under 65 microns with a preferred grain orientation, and an oxygen content that has been reduced to less than 50 ppm. This material has a 4N5 purity with low nobium content and is available for all leading PVD systems. The high strength, in excess of 20,000 psi, Tantalum Target assembly utilizes Tosoh SMD's patented PreludeÒ diffusion bonding technology.
Tosoh SMD, Inc., 3600 Gantz Road, Grove City, OH 43123. Tel: 614-875-7912; Fax: 614-875-0031.
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