Temperature Control Systems For Wafer Etch Equipment

Noah Precision, Inc.300 and Noah Precision, Inc.500 are a pair of products used for controlling wafer temperature during etch, and improve process control by incorporating solid-state, thermoelectric technology, eliminating compressors. Both tools eliminate the concerns associated with routine upkeep of compressor-based systems.

The dynamic temperature control systems support submicron geometry and feature dynamic cooling for maintaining temperature setpoint in real time, while optimizing each process step with tailored temperature setpoints. Dynamic temperature control also enables process flexibility, increases yield through temperature stability and eliminates temperature-induced CD variability.

Noah Precision, Inc.300 is designed for standard wafer etch and measures 11.8 x 4.4 x 21.9 inches. It supports a temperature range from –20°C to 90°C with a cooling capacity of 1200 watts at 20°C. Noah Precision, Inc.500 is designed for low temperature wafer etch. It measures 11.8 x 7.7 x 21.5 inches. Noah Precision, Inc.500 offers the same temperature range as the 3300, but has a cooling capacity of 2500 watts at 20°C.

<%=company%>, 6389 San Ignacio Avenue, San Jose, CA 95119, Phone: 408-281-7772, Fax: 408-281-7797