T-6100 Temperature Chuck System
Source: Thermonics Inc.
The T-6100 is designed to facilitate testing of wafers for device characterization and process integrity at a wide range of temperatures. Incorporation of an electrically passive chuck enables acquisition of low-level measurements without noise, leakage or capacitance difficulties.
The T-6100 is designed to facilitate testing of wafers for device characterization and process integrity at a wide range of temperatures. Incorporation of an electrically passive chuck enables acquisition of low-level measurements without noise, leakage or capacitance difficulties.
- Temperature range of -65C to +135C.
- Simplified operator interface.
- Low-profile chuck design.
- Frost-free operation.
Thermonics Inc., 3350 Scott Blvd #32, Santa Clara, CA 95054. Tel: 408-496-6838; Fax: 408-496-6918.
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