SVG Ships Multiple 200-APS Track Systems to U.S. and European Chip Manufacturers

SVG now shipping production units of advanced 200-APS tool to customers worldwide

Silicon Valley Group (SVG; San Jose, Calif.), a leading supplier of wafer processing systems to the worldwide semiconductor industry, today announced the shipment of multiple 200-APS next-generation photoresist processing tools. The systems will be used in the production of leading-edge logic devices by a major semiconductor manufacturer in the United States and for application-specific integrated circuits (ASICs) and logic devices by an established European semiconductor manufacturer at its most advanced fab. The shipments, which commenced in the first calendar quarter of 1998, mark the 200-APS's availability for volume production.

According to Papken Der Torossian, SVG's chairman and CEO, "By combining the 200-APS's superior technical specifications with our comprehensive service and support infrastructure, we are able to offer this customer a total photoresist processing solution that covers productivity, process performance and support. This shipment demonstrates the success of this total solution approach and exemplifies our commitment to supporting our overseas customers as they ramp production to meet the industry's demand for next-generation devices."

Working closely in a joint development effort with the U.S. customer, SVG demonstrated the 200-APS's ability to meet the manufacturer's stringent 0.25-micron and below lithography requirements and has committed to the system's reliability target of 1,000 hours within the first full year of production. Implementing both deep ultraviolet (DUV) and i-line system configurations, the customer will leverage the 200-APS's leading-edge technology, high productivity and process capability to perform advanced process development activities.

The 200-APS is among the industry's most advanced DUV processing systems, offering new features such as dual coater capability for wafer-to-wafer process consistency, improved bake modules, new expanded software capability, improved thermal control and superior wafer timing process control for improved critical dimension (CD) control in advanced applications. In addition, the system has 0.18-micron capability consistent with Sematech's 0.25-micron and below technology roadmap and throughput as high as 120 wafers per hour (WPH) with a small footprint area.

Edited by Nick Basta