SUSS Photolithography Solution Selected for Expanding Volume Manufacturing of LEDs
MUNICH, Germany-October 28, 2004 - Osram Opto Semiconductors continues to rely on photolithography solutions from SUSS MicroTec AG (FWB: SMH) for its high volume light emitting diode (LED) production. In 2004 Osram Opto Semiconductors has placed an additional follow-on order for SUSS LithoFab200 Production Lithography Cluster. The cluster is used for the manufacturing of nitride and arsenide/phosphide based LEDs.
The LithoFab200 enables the streamlining of the LED production process by automating and integrating all photolithography process steps, namely coat, bake, expose and develop, in one modular cluster system. For the fabrication of light emitting diodes it is crucial to maximize both the number of LED wafers processed per unit time as well as the number of good LEDs per processed wafer. With its production proven equipment design the LithoFab200 enables exceptional process scalability and fast time-to-market for new device designs, while reducing cycle times and excess wafer inventory.
Gerhard Maihöfner, Vice President Osram Opto Semiconductors:
"Photolithography steps are critical regarding overall output yield. In the LithoFab200 we achieve reliable control over the complete lithography process. For us, this results in a higher on-wafer yield than can be achieved with other lithography solutions available.
The cluster concept also enables us to minimize the cycle time for wafers in our fab and thus helps us reduce running costs. At the same time, the system is flexible enough to handle our diverse product and process mix without excessive downtime for retooling.
Within the LithoFab200, we have evaluated and implemented Mask Pellicle Technology from SUSS for yield enhancement. In summation, the above features are the main reasons why we rely on this technology."
"The continued success of Osram Opto Semiconductors in the tough but expanding LED market and the success of our lithography clusters at Osram Opto Semiconductors validate our approach for supplying production systems with a high level of integration", says Franz Richter, CEO of SUSS MicroTec AG. "We are especially pleased that Osram Opto Semiconductors has implemented Mask Pellicle TechnologyTM, part of our SupraYieldTM technology package."
SupraYield is a combination of technologies designed to enhance and extend the capabilities of SUSS' 1X full-field lithography (1XFFL) product offerings. It is comprised of Mask Pellicle TechnologyTM for defect control, a ThermAlignTM chuck for mask to wafer runout control, a large clearfield mask movementTM for reliable alignment of largely opaque masks, and the use of novel process technologies and materials which enhance resolution and resist profiles.
LED production is a maturing technology. In the years to come, as the race to conquer the general lighting market heats up, the trend of increased production efficiency is expected to continue and broaden. LED producers are setting up aggressive schedules for cost control in all aspects of the LED manufacturing process. SUSS is committed to support the industry's thrust towards lowering the all-important 'lumen-per-dollar' benchmark for LEDs by supplying lowest cost-of-ownership production solutions.
SUSS MicroTec's dedication to the LED and compound semiconductor industry is also reflected by the other SUSS product lines for related applications, namely automatic equipment solutions for LED bonding, LED testing, metal lift-off and nanoimprinting of small features for next generation light emitting devices.