SUSS MicroTec Unveils New Metrology Equipment For MEMS Production

Munich, Germany – With the DSM200, SUSS MicroTec has developed a new automated metrology system for all emerging front to backside alignment applications. The cassette-cassette front-to-back alignment metrology system is the ideal tool for verifying alignment accuracy on wafers from 2 inch to 200mm. Incorporating state-of-the-art pattern recognition technology, the DSM200 offers the highest measurement accuracy of 0.2 microns at 3 sigma on a fully automated platform with minimized operator intervention. Based on the latest production platform of the SUSS MA200Compact Mask Aligner, the DSM200 provides reliable and accurate metrology for double-sided alignment and exposure applications frequently used in the manufacturing of MEMS devices, power semiconductors and optoelectronics.

"We believe the DSM200 offers a value-engineered measurement solution exceeding the metrology requirements for the majority of double-sided aligned and exposed production applications," said Rolf Wolf, managing director of SUSS MicroTec' lithography division. "This further solidifies SUSS' position as the most comprehensive supplier of MEMS manufacturing equipment that provides complete equipment solutions from lithography to testing. Being a MEMS leader means ensuring continuous high quality standards along with superior application and service support."

SOURCE: SUSS MicroTec