WATERBURY, Vt.--(BUSINESS WIRE)--SUSS MicroTec (FWB:SMH)(GER:SMH), a leading supplier of process and test solutions for the semiconductor industry, announces the CB Series, semi and fully automated wafer bonders, for Advanced MEMS devices for the automotive and consumer markets.
There are a variety of wafer level bonding methods for MEMS fabrication processes like anodic and glass frit, with the most commonly used in Advanced MEMS being eutectic, fusion, and metal diffusion bonding.
The most challenging wafer level encapsulation and integration needs for MEMS are met by the newly released CB series wafer bonders designed for metal bonding applications that require high temperature and high force. CB technology features bond force to 90kN and temperatures to 600C along with precision temperature and pressure control for unrivaled process uniformity. These features enable significant die size and cost reduction for MEMS devices.
To meet the demanding alignment needs of advanced MEMS manufacturing SUSS MicroTec is releasing the BA200 Gen2, a high-precision alignment system, to complement the CB series.
For a smooth transition from the lab or low-volume production to full production recipes developed on the CB8, semi-automated wafer bonder, can easily be transferred to the CBC200, multi-chamber cluster tools.
About SUSS MicroTec
SUSS MicroTec listed in Deutsche Borse AG's Prime Standard is one of the world's leading suppliers of process and testing solutions for markets such as 3D Integration, advanced packaging, MEMS, nanotechnology and compound semiconductor. SUSS MicroTec enables its customers to increase process performance while reducing cost of ownership and to meet the volume requirements of fast growing markets with high quality solutions.
SUSS MicroTec supports more than 8,000 installed mask aligners, coaters, bonders and probe systems with a global infrastructure for applications and service.
Headquartered in Garching near Munich, Germany, SUSS MicroTec employs more than 730 employees worldwide.
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