Surface Profiler for Flip-Chip Packaging Process and Control

Veeco Process Metrology Group, a division of Veeco Instruments Inc., has introduced the WYKO SP3200 Surface Profiler for flip-chip packaging process and control. The gauge-capable SP3200 repeatably measures solder bump heights on organic substrates (from 150 micron for standard flip-chip bumps down to a few microns for under-bump metalization pads) and provides volume data on all bump sizes.

Designed to improve in-line process monitoring of flip-chip packaging, this non-contact, 3-D optical profiler provides dual process-control capabilities, functioning as both a surface metrology instrument and a defect inspection tool. As a defect inspection tool, the profiler automatically detects solder bridges, under & oversized bumps, missing & extra solder bumps, and bump position. For surface metrology, the system calculates bump height, diameter, volume, and three-point and regression coplanarity. The WYKO SP3200 enables users to control critical dimensions and determine the electrical/mechanical performance and reliability of advanced packaging substrates.

Running on a dual Pentium II PC with MMX technology under the Microsoft Windows NT 4.0 operating system, custom-designed WYKO Vision32 software provides full system control and powerful measurement analysis. Results and graphics are exportable to other Windows applications for off-line analysis and statistical process control. Enhanced software includes an automation scripting language, enabling customers to create their own measurement recipes. These recipes permit users to script an automated measurement sequence and create a lot-sampling plan.

Veeco Instruments Inc., Terminal Drive, Plainview, NY 11803. Tel: 516-349-8300; Fax: 516-349-8321.