Strip System

Featured at Semicon West

Mattson Technology Inc., will introduce its 300mm Aspen III Strip System at SEMICON West 98. Based on Mattson's production Aspen II platform, the Aspen III extends the concept of combining the high-throughput of batch systems with single-wafer processing performance to the 300mm production arena. Mattson will exhibit in Booth No. 218. Aspen III is designed to extend Moore's Law, an industry model observed by Intel's Gordon Moore that states that computing power doubles every 18 months.

By providing viable process technology and productivity options for current and future generations of semiconductors, the Aspen III Strip meets the stringent production requirements of 300mm wafer manufacturing. By processing greater than 200 wafers per hour (wph), Aspen III increases productivity for IC manufacturers while decreasing manufacturing costs. The Aspen III Strip system uses Mattson's proven Inductively Coupled Plasma source technology to generate a soft, magnetically confined plasma for low damage and residue cleaning capability. The fully automated system removes photoresist and polymers after processes such as high-dose implant, poly etch, and via etch strip applications.

Mattson Technology, Inc., 3550 W. Warren Ave., Fremont, CA 94538. Tel: 510-657-5900; Fax: 510-657-0165.