STMicroelectronics Implements Brion's Tachyon OPC+ For Advanced 45nm Chip Production

Santa Clara, CA - Brion Technologies recently announced that STMicroelectronics is producing 55 nanometer (nm) and 45nm devices using Brion's Tachyon OPC+ optical proximity correction (OPC) solution. This follows the successful completion of the companies' earlier OPC joint development program.

STMicroelectronics' adoption of Tachyon OPC+ combined with their current use of Tachyon Lithography Manufacturing Check (LMC), a model-based, full-chip, through-process-window lithography verification solution, for production at 90nm, 65nm and 45nm nodes provides STMicroelectronics an integrated computational solution.

"Tachyon's predictable run times, reliable performance and yield-sensitive inspection has had a positive impact on our advanced OPC flow deployment process," said Joël Hartmann, Silicon Technology Development director for STMicroelectronics, in Crolles, France. "Brion provides a clear economic benefit by delivering optimal cost of ownership as well as competitive technical solutions. We look forward to continuing this extremely productive collaboration."

"Brion is committed to delivering STMicroelectronics a comprehensive lithography solution to enable current and future development of semiconductor devices," said Jim Koonmen, general manager of Brion. "We are honored to collaborate with STMicroelectronics in optimizing lithography production efficiency."

STMicroelectronics is working closely with ASML and Brion to develop 45nm and 32nm OPC and lithography solutions. Brion products enable STMicroelectronics to access scanner-specific data for 32nm development and 45nm production.

SOURCE: ASML