Product/Service

Steam System

Source: STEAG Electronic Systems
STEAG RTP Systems has introduced their new 3000 Steam system, an advanced 300 mm/200 mm RTP tool designed for volume production of devices down to 0.10-micron
STEAG Electronic SystemsEMICON West 2000

STEAG RTP Systems will introduce their new 3000 Steam system, an advanced 300 mm/200 mm RTP tool designed for volume production of devices down to 0.10-micron. The system incorporates an externally generated steam capability with concentrations ranging from 1 percent to 90 percent. This externally generated steam capability builds upon the proven technology platform of STEAG's STEAMpulse RTP tool, which is successful in addressing shallow trench isolation, selective oxidation and gate oxidation applications.

The tool also features the ripple emissivity-independent temperature control capability, which provides repeatable results regardless of varying wafer backside conditions and allows for superior uniformity with a total components of variance (TCV) of +2°C. The system also includes a special slip-free ring design that entirely surrounds the wafer to eliminate edge effects, thus reducing wafer slip defects during high temperature processing. A dual arm robot ensures high throughput rates for excellent results in production environments.

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