News | July 26, 2005

STATS ChipPAC Rapidly Expanding Capacity And Technology Portfolio In China

Singapore -- STATS ChipPAC Ltd. announced it is rapidly expanding both its manufacturing capacity in China and the depth of its technology portfolio for advanced laminate packages and System-in-Package (SiP) solutions. The new facility will almost double the current manufacturing floor space.

A new 300,000 square foot facility will be built next to STATS ChipPAC's existing 430,000 square foot facility in the Qingpu District of Shanghai. The building construction is scheduled to begin in the third quarter of this year and will be facilitized according to customer demand with a targeted completion of the factory in mid 2006.

STATS ChipPAC Shanghai offers high volume, low cost turnkey solutions including wafer probe, assembly, test, and distribution. In addition to the planned floor space expansion, STATS ChipPAC has been rapidly building its technology base in China with advanced die attach and wire bond processes, advanced mold processes, film die attach, and 300mm wafer thinning down to 4 mils. With high volume production experience in three dimensional (3D) stacking and System-in-Package (SiP), STATS ChipPAC Shanghai is one of the most advanced integrated circuit (IC) subcontractors in China.

"STATS ChipPAC Shanghai offers significant value to our customers in terms of its volume manufacturing experience and quick turn assembly builds, strong technology, mature business process, ample space for growth, and proximity to growing mobile handset markets," said Wan Choong Hoe, STATS ChipPAC's Chief Operating Officer. "We view China as a strategic location to provide customers with high volume laminate products from design to distribution, evolutionary stacked die solutions, and advanced SiP technology."

Beginning in the first quarter of 2005, STATS ChipPAC Shanghai has ramped a variety of high volume laminate products to support multiple customers in markets such as chipsets, PC computing, consumer, and broadband applications. Research and development resources have been added to provide customers with full product development support for next generation emerging products as well as standard packaging programs.

"As we have expanded our technology portfolio and successfully ramped our production volumes in PBGA, stacked die, and SiP, customers are seeing more opportunities to be successful in China," said Ng Chong Meng, Managing Director, STATS ChipPAC Shanghai. "From research and development to design, assembly, and test, we have added the resources, equipment, and advanced processes necessary to ensure our customers have a competitive edge in their markets."