Standardized Solder-Laden Lead Frame

The continuous strip Solder-Laden leadframe from Die-Tech Inc. provides perfect solder joints when attaching leads and enables SIP, DIP or standard outline (SO) packages to be manufactured with a single leadframe. Rejects are eliminated, as is costly inspection and rework.

Each leadframe has the precise amount of solder needed in the pad attachment area to make excellent quality joints, eliminating the process step of screening the solder paste to the pads. The continuous strip is simply cut to the desired length and attached to each side of the component where it is needed. This means users can minimize the number of leadframe types they need to inventory.

The use of a standard leadframe saves time and costs by eliminating expensive hard tooling for each specific outline or I/O pattern. Because Die-Tech leadframes are stamped, many of the problems associated with chemically etched leads are eliminated. During the stamping process, Die-Tech rigorously controls the volume of solder available to each lead to the precise amount required.

Solder-Laden leadframes can be provided in pitches ranging from .010" centerline down to 0.5 mm. Clip style or flat paddle attachments are available. All of the most commonly used eutectic and high-temperature solder alloys are available with Die-Tech's Solder-Laden leadframes.

Die-Tech's Solder-Laden leadframe system is flexible enough to be used for large production runs or for prototyping or small production runs.

Die-Tech, Inc., 295 Sipe Road, York Haven, PA 17370. Tel: 717-938-6771; Fax: 717-938-6099.