Stacked Ball Grid Array Package

The Stacked Die Ball Grid Array (SDBGA) is a new integrated circuit (IC) package for the wired and wireless communications markets. It is distinguished by its stacking feature, combining various ICs in one package, which can significantly reduce not only manufacturing cost but also testing time and real estate on the motherboard.

Both the mounting area and chip weight of an product can be reduced as much as 70%, compared to conventional packages. SDBGA has all the characteristics of near Chip Scale Packages (CSP) -- advanced packages which are lighter weight, smaller size and provide higher performance.

In wireless communications, different ICs are used for a variety of functions. Handphones, for example, contain both flash and SRAM ICs and by stacking these on top of one another in an SDBGA package, the chip size is retained with enhanced capability. The product offers an ideal configuration for the emerging memory and logic combination in one package. Memory density and electrical performance are improved while reducing the package and testing costs that can occur prior to installation into a product.

Aside from handphones, Stacked Die BGAs are also ideal for MP3, MD players, and handheld devices such as PDAs, camcorders and palmtops. They can combine flash / SRAM, flash / logic and ASIC / memory ICs.

With its two-in-one feature, the total SDBGA package height is typically 1.4mm. Popular SDBGA sizes are 8x8mm to 14x14mm and pin count between 80 to 140.

ST Assembly Test Services, Inc. (STATS) , 5 Yishun St. 23,, singapore, , SG, 768442. Tel: 65-755-5885; Fax: 65-755-9006.