The STP machine is the ideal solution for advanced electronic device manufacturing. It can be used to seal, fill, and planarize, MEMS, LSI, and other devices.
The Spin coating film Transfer and hot-Pressing machine is used to planarize and fill uneven surfaces and for sealing a MEMS or 3-D stacked electronic device with a protective resin layer. The machine uses a combination of precise temperature control, vacuum processing, a film tension mechanism, and a film peeling machine (used to peel off a base film from a spin-coated material after the pressure transfer onto a substrate).
For information on the STP Machine’s specifications and a flow chart illustrating how it works, download the datasheet.