SOIC Tri-Temperature Handler

Featured at Semicon West

Micro Component Technology, Inc. introduces the MCT 5200 SOIC tri-temperature gravity handler. The MCT 5200 features the same proven gravity and pick and place technologies as the MCT 5100. In addition, the MCT 5200 incorporates a new (patent pending) heating and cooling system that eliminates restrictive chamber assemblies and the high cost of traditional LN2 cooling. System shipments began in July to multiple customers.

The MCT 5200 is a high-speed gravity fed handler designed for handling SOIC, TSSOP, SSOP, MSOP, and certain SOT and Chip Scale Packages (CSPs). With a throughput of 12,000 devices per hour, the MCT 5200 is a high speed, cost-effective solution for cold test. The modular design provides an ideal solution for handling packages that have very low mass and may require very short test times. This tri-temperature handler features temperature testing from -55C to +125°C. The handler can be configured for single or dual test site operation and for any combination of split kit package hardware, allowing two different package types to be handled on the system without any change-over time. This provides maximum flexibility for today's modern production floors. System Options include Auto-Load, Auto-Unload, and Plunge-to-Board with temperature control and various contacting systems including Kelvin, HPC, or Plunge-to-Board. The MCT 5200 handler provides low cost of ownership with its high throughput, high reliability, and simple operation, without the use of LN2, making this handler ideal for a wide variety of production needs.

MCT will be showcasing its new SOIC tri-temperature handler, the MCT 5200, at the Semicon West show in San Jose, CA at the San Jose Convention Center in McEnery Hall (Booth #11016) from July 15-17, 1998.

Micro Component Technology, Inc., Contact: Roger E. Gower, 612-697-4000 or Diane Nordenstrom, 612-697-4075.