SMART-Tool Semiconductor Micro-Analysis Review Tool

The SMART-Tool is a Defect Review Tool (DRT) that was designed for small particle compositional metrology on 300 & 200mm semiconductor wafers and read/write head substrates. This tool provides micro-analysis capability for particles down to 50 nm (or less), making it applicable to current and future device technologies. The tool is fully packaged to be compatible with the harsh environments of a fab, and is I300I and SEMI compliant. Wafer handling is fully robotic and automated, and is enclosed in a class 1 minienvironment. 300 mm wafers are accessed through a FOUP (Front Opening Unified Pod) and 200 mm wafers from an open cassette. Thin film head substrates, as well as other sample types, are also accessed from an open cassette. The base analytical technique for the SMART-Tool is Auger Electron Spectroscopy, which provides surface compositional analysis at very high spatial resolution. An optional EDX detector provides bulk compositional analysis of large defects (>1 mm). An optional Focused Ion Beam (FIB) provides in-situ cross-sectioning of device structures and buried defects.

Physical Electronics, 6509 Flying Cloud Drive, Eden Prairie, MN 55344. Tel: 952-828-6100; Fax: 952-828-6322.