Small Wire Bonder/Small Wire Conversion Kit
Source: Orthodyne Electronics
• Bonds to almost any electronic package requiring 38-75 micron (1.5-3 mil) wire.
• Bonds to almost any electronic package requiring 38-75 micron (1.5-3 mil) wire.
• Four-axis head allows bonding in any direction, to any type of module, leadframe or hybrid substrate.
• Programmable bonding parameters for each bond produce better bond quality and reliability.
• Available as a stand-alone machine, as part of a large and small dual head bonder, or as a retrofit to an existing 360C large wire bonder.
• Unique low maintenance bond head provides soft touchdown combined with high resolution
• LVDT for controlled bond placement.
• Motorized dereeler assembly and jewel bearing wire feed mean better looping control, low maintenance, and high uptime.
• Programmable lift-off angle and wire feed minimize heel cracks.
• Modular and flexible design makes for easy integration into automated lines and easy changeover between small and large wire.
• Four-axis head allows bonding in any direction, to any type of module, leadframe or hybrid substrate.
• Programmable bonding parameters for each bond produce better bond quality and reliability.
• Available as a stand-alone machine, as part of a large and small dual head bonder, or as a retrofit to an existing 360C large wire bonder.
• Unique low maintenance bond head provides soft touchdown combined with high resolution
• LVDT for controlled bond placement.
• Motorized dereeler assembly and jewel bearing wire feed mean better looping control, low maintenance, and high uptime.
• Programmable lift-off angle and wire feed minimize heel cracks.
• Modular and flexible design makes for easy integration into automated lines and easy changeover between small and large wire.
Orthodyne Electronics, 2300 Main Street, Irvine, CA 92614-6223. Tel: 949-660-0440; Fax: 949-660-0444.
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