Sirus
The Sirus Reactive Ion Etching (RIE) system is designed to etch dielectrics and other films which require fluorine-based chemistries.
The system has been designed to meet all safety and etching requirements in the laboratory environment. Its modular design provides the engineer with a turnkey system that meets all safety, facility and processing needs. The Sirus's flexibility and innovations are a major reason for Trion Technology's success.
Applications
Processes have been thoroughly developed for anistrophic etching of silicon dioxide, silicon nitride, and other materials requiring high selectivity and a controlled anistropic etch. Our demonstration lab is available to process samples and develop etch processes for net materials.
System specifications: 35"Wx26"Dx48"H
RF Power: 300 watt, 13.56 MHz
Up to 4 Mass Flow Controllers
Maximum wafer size: up to 6"
Trion Technology, 1025 South 52nd Street, Tempe, AZ 85281. Tel: 480-968-8818; Fax: 480-968-5596.